United States Die Bonder Equipment Market by Manufacturers, States, Type and Application, Forecast to 2022
Die bonding is the method of attaching a chip or die to a package
or substratum. Die bonding, also referred as die attaching is the process of
bonding or attaching a chip either to a substrate or to some package or another
die. This process can obtain many forms and can be useful in various different
ways. Hence, die bonder equipment is used broadly in the fabrication and manufacture
procedure of semiconductor devices. Die bonder equipment executes a variety of
functions including picking out the die from wafer or waffle tray and connecting
it to the substrate or other die. The most frequently used practice of die attaching
is to move forward the aimed die from the tape with the assistance of a pin.
Die attaching procedure is carried out by using several techniques such as
eutectic bonding, adhesive bonding, soldering and glass /silver & glass
bonding.
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The United
States die bonder equipment market is anticipated to experience a
stable growth during the forecast period from 2017 to 2022 owing to the rapid
growth of the semiconductor industry with prominent compound annual growth
rate. Growing demand of semiconductor Integrated Circuits is one of the key
important factors expected to propel the requirement of die bonder equipment in
the near future. Rising need of electronic systems with the escalating no of
several end user applications is forecasted to provide the stimulus for mounting
demand of Integrated Circuits. This in spin is probably to activate the market
growth of die bonder equipment in the United States. In addition, budding
market for most recent technologies like Internet of Things, UHD TVs (Ultra
High Definition Television) and hybrid laptops is most likely to fuel the
demand for semiconductor Integrated Circuits, which as result is foretold to propel the requirement
of various die bonder equipment, in the coming years,. Furthermore, rising
trend towards automation in automotives is one more significant factor estimated
to generate massive demand of Integrated Circuits essential for a range of
functions like GPS, ABS, power doors and windows, airbag control, car
navigation and display and automated driving amongst others. This is likely to boost
the requirement for advanced and innovative packaging techniques like die
bonders.
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The key market players in the United States Die Bonder
Equipment market are HYBOND, Inc., BE
Semiconductor Industries N.V. (Besi), West·Bond, Inc., ASM Pacific Technology
Ltd., DIAS Automation (HK) Ltd., Fasford Technology Co., Ltd., Kulicke and
Soffa Industries, Inc., Panasonic Corporation, SHINKAWA Electric, Toray
Engineering Co., Ltd. and Palomar Technologies, Inc. According to types, the market industry is
segmented into; fully Automatic, Semi-Automatic and Manual. By applications,
the Die Bonder Equipment market is split into; Integrated Device Manufacturers
(IDMs) and Outsourced Semiconductor Assembly and Test (OSAT). Geographically, the
United States Die Bonder Equipment market is segmented into states which are;
Illinois, California, Florida, Texas and New York.
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Some Point From TOC:
Table of
Contents
1 Market
Overview
1.1 Die
Bonder Equipment Introduction
1.2 Market
Analysis by Type
1.2.1
Fully Automatic
1.2.2
Semi-Automatic
1.2.3
Manual
1.3 Market
Analysis by Applications
1.3.1
Integrated Device Manufacturers (IDMs)
1.3.2
Outsourced Semiconductor Assembly and Test (OSAT)
1.4 Market
Analysis by States
1.4.1
California Status and Prospect (2012-2022)
1.4.2
Texas Status and Prospect (2012-2022)
1.4.3 New
York Status and Prospect (2012-2022)
1.4.4
Florida Status and Prospect (2012-2022)
1.4.5
Illinois Status and Prospect (2012-2022)
1.5 Market
Dynamics
1.5.1
Market Opportunities
1.5.2
Market Risk
1.5.3
Market Driving Force
2
Manufacturers Profiles
2.1 Besi
2.1.1
Profile
2.1.2 Die
Bonder Equipment Type and Applications
2.1.2.1
Type 1
2.1.2.2
Type 2
2.1.3 Besi
Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share
(2016-2017)
2.1.4
Business Overview
2.1.5 Besi
News
2.2 ASM
Pacific Technology (ASMPT)
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